資料案内
モバイル & ワイヤレス
携帯電話
- タイトル
2008 Mobile Phone Platform Market & Development
- 発刊年/月
- 2008/9
- 体 裁
- A4 :139ページ
- 価 格
-
300,000円 (日本語/ハードコピー)
390,000円 (日本語/ハードコピー + PDFデータ)
3,500USドル (英語/ハードコピー) 4,500USドル (英語/ハードコピー + PDFデータ)
- 概 要
-
本資料では携帯電話プラットフォームの市場、ベンダ、開発動向をまとめております。
プラットフォームには、携帯電話baseband/ Protocol Stack、Application CPU/High Level OS/ UI、Media Porcessorを含めております。
- 目次
-
1. Summary1.1. TSR Perspectives2. Mobile Phone Roadmap
1.2. Mobile Platform Industry Map
1.3. Platform Vendors Positioning
1.4. Mobile Phone Market Trend by Standard (CY2006-2013)
1.5. Mobile Phone Function Penetration Forecast (CY2006-2013)
1.6. Mobile Phone Vendors Market Share (CY2006-2008)
1.7. WCDMA Mobile Phone Vendors Market Share (CY2006-2008)
1.8. Mobile Platform Vendors Market Share (CY2006-2008)
1.9. 3G Platform Vendors Market Share (CY2006-2008)
1.10. A-CPU Vendors Market Share (CY2006-2008)2.1. Cellular Standards Roadmap3. Mobile Phone Market
2.2. Mobile Phone Application/ Function Roadmap
2.3. 3G Network Roadmap by Major Mobile Operator
2.4. Major 3G/3.9G Patent Holder3.1. Mobile Phone Market Forecast (CY2006-2013)4. Mobile Platform3.1.1. Mobile Phone Market Forecast by Standard3.2. Mobile Phone Function Penetration Forecast (CY2006-2013)
3.1.2. Mobile Phone Market Forecast by Area
3.3. Mobile Handset Vendor Share by Standard (CY2006-2008F)3.3.1. Mobile Phone Total3.4. Smart Phone Vendor Share (CY2006-2008, by High-Level OS)
3.3.2. WCDMA
3.3.3. GSM/EDGE
3.3.4. CDMA 1x/ EV-DO3.4.1. Symbian
3.4.2. Linux
3.4.3. Windows Mobile4.1. Mobile Platform Composition Trend
4.2. Major Platform Vendor’s List
4.3. Supply Matrix4.3.1. Supply Matrix by Major Handset Vendor4.4. Platform Roadmap by Major Handset Vendor
4.3.2. Baseband
4.3.3. A-CPU4.4.1. Nokia4.5. Mobile Platform Semiconductor Market Forecast (CY2006-2013)
4.4.2. Samsung
4.4.3. Motorola
4.4.4. LG
4.4.5. SonyEricsson
4.4.6. Sharp
4.4.7. PMC
4.4.8. NEC
4.4.9. Toshiba
4.6. Platform Vendor Share (CY2006-2008)4.6.1. Baseband Processor Vendor Share4.7. Platform Semiconductor Pricing Forecast (CY2006-2013)4.6.1.1. WCDMA/ HSDPA4.6.2. A-CPU Vendor Share
4.6.1.2. GSM/ EDGE
4.6.1.3. CDMA 1x/ EV-DO4.6.2.1. A-CPU Vendor Share by HLOS4.6.3. Media Processor Vendor Share
4.6.2.2. Symbian
4.6.2.3. Linux
4.6.2.4. Windows Mobile4.7.1. Baseband4.8. Platform Roadmap/ Development Trend
4.7.2. A-CPU/ Media Processor4.8.1. Integration Trend (RF+BB, BB+ACPU, Peripherals Integration)4.9. Platform IC Vendors Case Study
4.8.2. Smart Phone Platform
4.8.3. Low Cost Platform (BB/RF SoC)
4.8.4. HSPA-LTE Roadmap
4.8.5. CPU
4.8.6. Graphics
4.8.7. Platform Roadmap by Major Vendors
Topics: STN-EMP Merger