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株式会社テクノ・システム・リサーチ

資料案内

モバイル & ワイヤレス携帯電話

タイトル

2008 Mobile Phone Platform Market & Development

発刊年/月
2008/9
体 裁
A4 :139ページ
価 格
300,000円 (日本語/ハードコピー) 390,000円 (日本語/ハードコピー + PDFデータ)
3,500USドル (英語/ハードコピー) 4,500USドル (英語/ハードコピー + PDFデータ)
概 要

本資料では携帯電話プラットフォームの市場、ベンダ、開発動向をまとめております。

プラットフォームには、携帯電話baseband/ Protocol Stack、Application CPU/High Level OS/ UI、Media Porcessorを含めております。

目次
1. Summary
1.1. TSR Perspectives
1.2. Mobile Platform Industry Map
1.3. Platform Vendors Positioning
1.4. Mobile Phone Market Trend by Standard (CY2006-2013)
1.5. Mobile Phone Function Penetration Forecast (CY2006-2013)
1.6. Mobile Phone Vendors Market Share (CY2006-2008)
1.7. WCDMA Mobile Phone Vendors Market Share (CY2006-2008)
1.8. Mobile Platform Vendors Market Share (CY2006-2008)
1.9. 3G Platform Vendors Market Share (CY2006-2008)
1.10. A-CPU Vendors Market Share (CY2006-2008)
2. Mobile Phone Roadmap
2.1. Cellular Standards Roadmap
2.2. Mobile Phone Application/ Function Roadmap
2.3. 3G Network Roadmap by Major Mobile Operator
2.4. Major 3G/3.9G Patent Holder
3. Mobile Phone Market
3.1. Mobile Phone Market Forecast (CY2006-2013)
3.1.1. Mobile Phone Market Forecast by Standard
3.1.2. Mobile Phone Market Forecast by Area
3.2. Mobile Phone Function Penetration Forecast (CY2006-2013)
3.3. Mobile Handset Vendor Share by Standard (CY2006-2008F)
3.3.1. Mobile Phone Total
3.3.2. WCDMA
3.3.3. GSM/EDGE
3.3.4. CDMA 1x/ EV-DO
3.4. Smart Phone Vendor Share (CY2006-2008, by High-Level OS)
3.4.1. Symbian
3.4.2. Linux
3.4.3. Windows Mobile
4. Mobile Platform
4.1. Mobile Platform Composition Trend
4.2. Major Platform Vendor’s List
4.3. Supply Matrix
4.3.1. Supply Matrix by Major Handset Vendor
4.3.2. Baseband
4.3.3. A-CPU
4.4. Platform Roadmap by Major Handset Vendor
4.4.1. Nokia
4.4.2. Samsung
4.4.3. Motorola
4.4.4. LG
4.4.5. SonyEricsson
4.4.6. Sharp
4.4.7. PMC
4.4.8. NEC
4.4.9. Toshiba
4.5. Mobile Platform Semiconductor Market Forecast (CY2006-2013)
4.6. Platform Vendor Share (CY2006-2008)
4.6.1. Baseband Processor Vendor Share
4.6.1.1. WCDMA/ HSDPA
4.6.1.2. GSM/ EDGE
4.6.1.3. CDMA 1x/ EV-DO
4.6.2. A-CPU Vendor Share
4.6.2.1. A-CPU Vendor Share by HLOS
4.6.2.2. Symbian
4.6.2.3. Linux
4.6.2.4. Windows Mobile
4.6.3. Media Processor Vendor Share
4.7. Platform Semiconductor Pricing Forecast (CY2006-2013)
4.7.1. Baseband
4.7.2. A-CPU/ Media Processor
4.8. Platform Roadmap/ Development Trend
4.8.1. Integration Trend (RF+BB, BB+ACPU, Peripherals Integration)
4.8.2. Smart Phone Platform
4.8.3. Low Cost Platform (BB/RF SoC)
4.8.4. HSPA-LTE Roadmap
4.8.5. CPU
4.8.6. Graphics
4.8.7. Platform Roadmap by Major Vendors
Topics: STN-EMP Merger
4.9. Platform IC Vendors Case Study
celluler 300,000円